By Charles Hamilton
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Additional info for A Guide to Printed Circuit Board Design
8 T a p i n g angles With the tracks and component mounting pads laid, consideration must now be given to the provision of test pads for test probe location - see (9) on page 24. These are required after the PCB has been fully assembled. ). 9 Example location of test pads general, be too critical, but care must be exercised in the placement of the test pads in the high-impedance areas of the PCB. 1, square test pads are preferred, mainly for ease of identification and also to minimise the risk of the manufacturer inadvertently putting an unwanted hole through the pad.
The letter codes and board periphery are added in ink to the solder side conductor pattern view on the front face of the drawing, together with the outline dimensions of the PCB. 1). 006in) positional tolerance diameter from TP, and supported by a prominent note: HOLE POSITIONS 0 0,161 M A S T E R PATTERN S O L D E R SIDE This can be achieved by the manufacturer using numerically controlled drilling methods. A datum corner should also be shown on the solder side conductor pattern view, if other artworks/master patterns are to be used in the manufacture of the board.
The master patterns now produced from the photo-plotter should conform exactly to the final Biro plot (except that the Biro plot will have been produced at the layout scale and the master pattern at 1:1). However, nothing can be left to chance and the master patterns will be subjected to the same stringent checking as applied to the Biro plot(s) earlier. The PCB designer will check specific pads, tracks and gaps for dimensional accuracy, using precision optical measuring scales. He will also check the register between the master patterns, and, where applicable, comparison checks should be carried out if there are any 1:1 reduced copies of taped master artworks available.
A Guide to Printed Circuit Board Design by Charles Hamilton